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  MMT offers total Turn-Key Solutions for your semiconductor packaging needs:

  ? Wafer Back Grinding: 8 inch max Si, GaN,
  ? Wafer Probe
  ? Assembly (Plastics & Special Products , GaAs wafers)
  ? Hermeticity Testing - Fine Leak with Kr85 & Gross Leak
  ? Temperature Cycling
  ? PIND Testing and Burn–In
  ? Final Test – memory, analog, mixed signals & logic devices
  ? Solder Dip (63/37, 95/5)
  ? Drop Shipment
  ? Full Reliability Test Capability
  ? Plating Services (Matte Tin,Tin-Lead)

Image Sensor
Metal Cans

 Full range of HiRel
 ceramic packaging

  Portfolio includes:
  CDIP, LCC, Side braze
  CQFP, Flat packs, PGA,
  MCM, SIP, and Flip
  Chip BGA.

 Full range of HiRel
 plastic packaging


 PCBA assembly
 capable of
 handling down
 to 01005
 component size

 High-End Image
 Sensor assembly
 in a dedicated
 super clean Class 100

 Wide range of
 metal cans
 TO3, TO99
 TO18, TO5

 Probing in
 class 100 and 10k

 100% Matte Tin on
 Cu, Alloy frame.
 High speed
 plating line.

"Quality Comes First"


  ? Full QML Class Q - DLA Certified
  ? Full QML Class V - DLA Certified
  ? MIL-PRF-38535  &  MIL-STD 883 (Microcircuits)
  ? MIL-PRF-38534  &  MIL-STD 883 (Multichip Module)
  ? MIL-PRF-19500  &  MIL-STD-750 (Discretes)
  ? ITAR Approved - Customer Specific

Environmental, Health & Safety

  ? ISO 14001 : 2004
  ? UL FM Approval
  ? Sony Green Partner

Management Systems

  ? ISO/TS 16949 : 2009
  ? ISO 9001 : 2008

MMT Provide a full range of specialized packaging.
MMT's main production area houses probe, assembly, and final test.
Facilities includes:
         ? Manufacturing area of >200,000 square feet
         ? A Class 100, 1K , 10K , 100K clean-room environment
         ? ESD Controlled < 100 Volts HBM & < 40 Volts MM
         ? Office space available for customers
         ? Customer Internet and VPN access
         ? No Floods !

Company Facts

MMT is a Business Unit of Microchip Technology (Thailand) Co., Ltd.

Copyright 2016. Microchip Technology(Thailand) Co.,Ltd. All Rights Reserved.
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